Pob zeb diamond ntug sib tsoo

Pob zeb diamond ntug sib tsoo

Basic Info

• Qauv TSIS MUAJ: tsim kho

• Abrasive: Superabrasive

• Hom: Ntug Sib Tsoo Log

• Cylindricity: Customized

• Technics: Hlau Bonded

• Txuj: Jb / T 7425-2012

• Hom: Diasc

• Pob: Thawv

• Keeb kwm: Cn

• Khoom siv: Hlau Bonded

• Cov duab: Disc

• Grain Size: Kev Kho Mob

• Vev Kev Ntsuas: Kho

• Ua haujlwm Style: Ntug Sib Tsoo

• Hnav khaub ncaws: Hnav ris tsho

• Lub npe: diasc

• Specification: customized

• HS Code: 68042100

Cov Lus Qhia Txog

Cov ntsiab lus
Hlau pob zeb diamond yuav siv rau ntug sib tsoo ntawm silicon wafers.
Sib tsoo pob txha rau txoj kev siv cov khoom semiconductor substrates.
Tsaug rau ib qho kev tsim featuring ib txheej txheej zoo ntawm cov nplej zoo thiab high-precision xov tshuab, cov cav sib tsoo no ua qhov zoo-siab, muaj kev sib tsoo machining tau nrog tsawg chipping.
Ob leeg txheej-circumference machining thiab nqis thais machining log yog muaj nyob rau hauv peb hom: Ib qho zawg-zawg, ntau qhov zaws, thiab kev sib txoos tas.

Nta

• Txawm thiab tsis muaj pob zeb diamond los ua kom mintsis ua puas.

• Muab txoj hlua khi tiv thaiv kom ruaj khov siab siv los ua kom muaj lub siab tawv thiab lub neej ntev.

• Highly precise slotted puab thiab nishing technology txhawb ntau wafer daim.

• Tooj tooj-tsis txaus siab.

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